IEEE International 3D Systems Integration Conference (3DIC)
Oct 1 – 2, 2026
Georgia Institute of Technology — Atlanta, Georgia

 

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The 2026 3DIC conference will be held October 1 – 2
at the Georgia Institute of Technology in Atlanta, GA

3DIC 2026 will cover all 3D system integration topics including 3D/2.5D process technology, interposers, and chiplets, materials, equipment, circuit technology, design methodology, and applications. Attendees will interact with researchers from all around the world.

Important dates:

  • Registration: Open now
  • Vendor registration: Open now
  • Abstract submission: Closed
  • Acceptance notifications: September 14
  • Full camera-ready submissions due: September 29

Keynote Speakers

Sandeep Kumar Goel, TSMC
Academician & Sr. Director

Sung Kyu Lim, University of Southern California
Dean’s Professor of Electrical and Computer Engineering

Rozalia Beica, Rapidus
Field CTO of Packaging Technologies

Muhannad S Bakir, Georgia Tech
Dan Fielder Professor, Director of 3D Systems Packaging Research Center

More information on the Program page