Call for Papers

Deadline for papers and proposals is June 30, 2016. Abstracts are to be 500 words in length, and some figures and tables can be included. Notifications will occur by AugustĀ 15,...

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The IEEE International Conference on 3D System Integration (3D IC) will be held in San Francisco, California on November 8-10, 2016. This conference combines the previous ASET and IEEE EDS Japan sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the IEEE CPMT sponsored 3D System Integration Conference held in 2003 & 2007 in Munich. After the first combined conference in San Francisco in 2009, the 2nd IEEE International Conference on 3D System Integration was held in Munich in 2010, the 3rd conference in Osaka in 2012, the forth conference in San Francisco in 2013, the fifth conference in Cork in 2014, and the sixth conference in Sendai in 2015. 3D IC will cover all 3D IC topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications.