IEEE
                                             3D System Integration Conference 2009
 
                                                            September 27th  2009,
 
                                                      San Francisco, California, USA

                                                                 3D IC Integration
                                                         Pre-Conference TUTORIAL
 
 9:00            Intro, 3D  Drivers                         Phil Garrou (MCNC)
 
 9:45            Definitions and classifications     Eric Beyne  (IMEC)
 
10:30           Coffee break
 
11:00           3D Processing
                       (TSV, thining & bonding)           James Lu (RPI)
 
12:00           Lunch
 
1:00             Commercial applications,
                      evolving infrastructure                Phil Garrou  (MCNC)
 
1:45             3D  design                                    Paul Franzon (NCSU)
 
2:30             Coffee break                           
 
3:00             Test                                             Tenaka-san (Tohuku Univ)
 
3:45             Self Assembly                               Koyanagi-san (Tohuku Univ)
 
4:15             Closing remarks
 
Cost is $150 for attendees and $50 for students.
Lunch will not be provided.