Program
September 28-30, 2009, San Francisco, California, USA
Click here for Conference Program
Presentation slides of Keynote speakers and Invited papers:
Keynote Speaker: Dr. Hajime Sasaki, Executive Advisor and Former Chairman of NEC Corporation, "System LSI Design Issues and 3-D Integration Technology"
Keynote Speaker: Matt Nowak, Qualcomm, "High Density Through Silicon Stacking - how the fabless supply chain impacts technology decisions"
Keynote Speaker: Eric Beyne, "European R&D Activities for 3D Integrated Heterogeneous Systems", Fred Roozeboom1, Eric Beyne2, Gilles Poupon3, and Peter Ramm4, 1Eindhoven Univ. of Technology, Netherlands, 2IMEC, 3Leti, 4Fraunhofer IZM, Germany.
Invited Paper: Morihiro Kada, Association of Super-Advanced Electronics Technologies (ASET), Japan. "Development on Functionally Innovative 3D-Integrated Circuit (Dream Chip) Technology"
Invited Paper: Daniel Radack, IDA, "3D Integrated Circuit Technology: Perspective of US Research and Development Activities"
"Wafer-Scale 3D Integration of InGaAs Image Sensors with Si Readout Circuits", C.L. Chen, D-R. Yost, J.M. Knecht, D.C. Chapman, D.C. Oakley, L.J. Mahoney, J.P. Donnelly, A.M. Soares, V. Suntharalingam, R. Berger, V. Bolkhovsky, W. Hu, B.D. Wheeler, and C.L. Keast, Lincoln Laboratory, Massachusetts Institute of Technology.
Best Student Paper Award
"Junction-level Thermal Extraction and Simulation of 3DICs", Samson Melamed, Thorlindur Thorolfsson, Adi Srinivasan*, Edmund Cheng*, Paul Franzon and Rhett Davis, North Carolina State University, *Gradient Design Automation.
