November 16-18, 2010, Munich, Germany

3DIC 2010

This conference combines the previous ASET and IEEE EDS Society sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the Fraunhofer and IEEE CPMT sponsored International 3D System Integration Workshop held in 2003 & 2007 in Munich. After the first combined conference in San Francisco 2009, the 2nd IEEE International Conference on 3D System Integration will be held in Munich in 2010, rotate to Tokyo in 2011 and then rotate back to San Francisco in 2012.

3DIC 2010 will cover all 3D Integration topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and attendees to submit and interact with 3D integration researchers from all around the world.

Email Subscription

To receive future notices about this meeting, please send an email to subscribe@3dic-conf-munich.org. The content of the email should be subscribe 3dic-conf email where "email" is your email address.

The 2nd IEEE International 3D System Integration Conference (3DIC 2010) will be held at the "Fraunhofer Haus" in Munich on November 16-18th, 2010.