Welcome to the 3DIC: IEEE International 3D Systems Integration Conference Website
The IEEE International Conference on 3D System Integration (3D IC) will be held in San Francisco in October, 2013.
Presentation abstracts and proposals for panels and tutorials should be submitted on the conference web site: www.3dic-conf.org . Deadline for papers and proposals has been extended to May 15, 2013. Abstracts are to be 500 words in length.
3D IC will cover all 3D IC topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and attendees to submit and interact with 3D researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:
3D IC Technology: Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration, Capacitive coupling, Inductive coupling, multilevel epitaxial growth, etc.
3D IC Circuits Technology: 3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D Biomedical circuits etc.
3D Applications: imaging, memory, processors, communications, networking, wireless, biomedical etc.
3D Design Methodology: 3D CAD, 3D synthesis, 3D design flows, Signal and power integrity analysis and design in 3D, 3D thermal design and analysis, test and design for test; 3D mechanical stress and reliability design and analysis, etc.
Presentation abstracts and proposals for panels and tutorials should be submitted on the submit tab above . Deadline for papers and proposals is April 30 , 2013. Abstracts are to be 500 words in length, and some figures and tables can be included. Please upload a PDF file. Notifications will occur by June 15 and full papers in IEEE format will be required by July 31, 2013.