September 28-30, 2009, San Francisco, California, USA

The IEEE International Conference on 3D System Integration (3D IC) will be held at the Hyatt, Embarcadero in San Francisco on September 28-30th, 2009.

This conference combines the previous ASET and IEEE EDS Society sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the IEEE CPMT sponsored 3D System Integration Conference held in 2005 & 2007 in Munich. The new, combined Conference will be held in San Francisco in 2009, rotate to Munich in 2010 and then rotate back to Tokyo in 2011.

3D IC will cover all 3D IC topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and attendees to submit and interact with 3D researchers from all around the world.

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