2015 3DIC AUG. 31-SEP. 2, 2015 SENDAI, JAPAN / IEEE

2015 3DIC AUG. 31-SEP. 2, 2015 SENDAI

Welcome to the 3DIC: IEEE International 3D Systems Integration Conference Website

3D IC Technology: Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration, Capacitive coupling, Inductive coupling, multilevel epitaxial growth, etc.

3D IC Circuits Technology: 3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D Biomedical circuits etc.

3D Applications: imaging, memory, processors, communications, networking, wireless, biomedical etc.

3D Design Methodology: 3D CAD, 3D synthesis, 3D design flows, Signal and power integrity analysis and design in 3D, 3D thermal design and analysis, test and design for test; 3D mechanical stress and reliability design and analysis, etc.

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